doc. no : qw0905- rev. : a date : super bright oval type led lamps 10 - oct. - 2008 lhrf13430/s14-pf data sheet lhrf13430/s14-pf pb lead-free parts ligitek electronics co.,ltd. property of ligitek only
note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. radiation angle(0.5):h 70 degree/v 50 degree 25% vertical axis 50 100% -60 75%50% 25%0 horizontal axis 70 directivity radiation -30 0 100% 50%75% 60 30 25.0min 1.0min 7.4 4.31 ligitek electronics co.,ltd. property of ligitek only 2.54typ + - 0.5 typ 1.5max lhrf13430/s14-pf part no. package dimensions 5.0 1/5 page
vertical axis 50 horizontal axis 70 static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. ligitek electronics co.,ltd. property of ligitek only unit a page viewing angle 2 1/2 (deg) note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. material typical electrical & optical characteristics (ta=25 ) part no lhrf13430/s14-pf 20 luminous intensity @20ma(mcd) spectral halfwidth nm dominant wave length dnm forward voltage @ ma(v) 630 red diffused algainp red emittedlens 450 2.4220 1.5 20 max. min.min. typ. color peak forward current duty 1/10@10khz electrostatic discharge( * ) reverse current @5v power dissipation forward current storage temperature operating temperature * tstg t opr -40 ~ +100 -40 ~ +85 pd esd ir i fp i f mw 75 2000 10 v 90 30 ma ma parameter absolute maximum ratings at ta=25 symbol hrf ratings 2/5 part no. lhrf13430/s14-pf
r e l a t i v e i n t e n s i t y @ 2 0 m a 600 wavelength (nm) 550 0 700 650 0.5 0.5 r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 20 ambient temperature( ) fig.5 relative intensity vs. wavelength 1.0 ambient temperature( ) 0.8 -0 -20 -4060 40 2080100 0 -40-20-060 4080100 fig.4 relative intensity vs. temperature 2.5 1.0 0.9 1.1 1.5 1.0 2.0 fig.3 forward voltage vs. temperature 1.2 3.0 100 r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a f o r w a r d c u r r e n t ( m a ) forward current(ma) forward voltage(v) 1.5 1.0 0.1 2.5 2.03.01.010 0 1.0 10 0.5 1.0 1.5 2.0 1001000 fig.2 relative intensity vs. forward current fig.1 forward current vs. forward voltage 1000 3.5 2.5 typical electro-optical characteristics curve ligitek electronics co.,ltd. property of ligitek only 3.0 hrf chip page 3/5 part no. lhrf13430/s14-pf
note: 1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. 5 /sec max 60 seconds max 2 /sec max 25 0 0 preheat 50 120 100 temp( c) 260 260 c3sec max time(sec) 150 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) ligitek electronics co.,ltd. property of ligitek only page 4/5 part no. lhrf13430/s14-pf
1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) solder resistance test 1.t.sol=260 5 2.dwell time= 10 1sec. 1.t.sol=230 5 2.dwell time=5 1sec solderability test operating life test high temperature high humidity test thermal shock test 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs low temperature storage test high temperature storage test reliability test: test itemtest condition mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 this test intended to see soldering well performed or not. mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202:103b jis c 7021: b-11 the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. the purpose of this test is the resistance of the device under tropical for hours. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. jis c 7021: b-12 mil-std-883:1008 jis c 7021: b-10 description reference standard ligitek electronics co.,ltd. property of ligitek only page 6/6 part no. lhrf13430/s14-pf
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